Published on Sunday May 1, 2005
Kulicke & Soffa (K&S), with the help of Dr. David Beatson, Chief Technology Officer at K&S and member of the Department of Materials Science and Engineering Visiting Advisory Board, has donated a Kulicke & Soffa 1488 ball bonder to the Department of Materials Science and Engineering at Drexel University. The K&S 1488 is a self-contained, fully-automated wire bonding system for attaching thin gold wire interconnections to semiconductor integrated circuits (IC), as well as micro-electromechanical systems (MEMS). It is complete with a microscope, an xyz stage, a high-precision micropositioner, and a computer, capable of locating and bonding gold wires as thin as 25 microns in diameter on a gold or aluminum surface no larger than 50 microns in diameter. The K&S 1488 will be used by Drs. Wan Y. Shih and Wei-Heng Shih and their research group to help the development of array piezoelectric microcantilever sensors.
The equipment was dedicated at the annual meeting of the Department of Materials Science and Engineering Visiting Advisory Board on Friday, April 29, 2005. David Beatson was on hand to accept the plaque on behalf of Kulicke & Soffa. The text of the plaque appeared as follows: THIS PLAQUE IS PRESENTED TO KULICKE & SOFFA IN RECOGNITION OF AND GRATITUDE FOR THE GIFT OF THE KULICKE & SOFFA 1488 BALL BONDER TO THE DEPARTMENT OF MATERIALS SCIENCE AND ENGINEERING DREXEL UNIVERSITY AT ITS FORMAL DEDICATION APRIL 29, 2005 Kulicke & Soffa is the world's leading supplier of semiconductor assembly equipment, tools, and materials. The department greatly appreciates the generosity of companies like Kulicke & Soffa.